IEC 60352-5 sets global standards for solderless, press-in connections, defining requirements for high-reliability, eco-friendly cold welds in electronic components. The current 2020 edition provides comprehensive guidelines on materials, test methods for contact resistance, and connection procedures. For a direct overview of the standard from the International Electrotechnical Commission, visit IEC Webstore.
Key aspects covered include:
Refined Testing: Removed obsolete tests (like the bending test) and modified copper thickness limits for plated-through holes to reflect current market trends. Testing and Qualification iec 60352-5 pdf
The standard mandates tensile force tests. A compliant wrap can withstand significant pull forces without failing, making it ideal for backplanes, telecommunication switches, and aerospace systems. IEC 60352-5 sets global standards for solderless, press-in
Reliability in electronics doesn't always require a soldering iron. For high-density boards and complex assemblies, press-in technology Dry heat : 125°C for 16 h (class
This international standard outlines the general requirements, test methods, and practical guidance for solderless press-in connections. A press-in connection involves taking a termination (like a pin) with a specific "press-in zone" and forcing it into a plated-through hole on a board.
Unlike soldering, wrapping requires no external heat. This eliminates thermal shock to sensitive components and removes the risk of flux contamination—critical for high-impedance circuits and medical electronics.
